JIG FOR SUBSTRATE BONDING, WAFER FOR LIGHT-EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, LIGHT-EMITTING ELEMENT AND CHIP THEREFOR

摘要

PROBLEM TO BE SOLVED: To carry out a lot of wafer laminations inexpensively, and to improve the yield of wafer lamination even when the wafer size is large.

SOLUTION: The jig is formed for substrate bonding used for laminating a first substrate in which a semiconductor light-emitting layer, and a second substrate prepared separately from the first substrate. Further, the jig is equipped with a pair of plates to hold from both sides the laminated wafer composed by interposing the first substrate and the second substrate; a holding member to retain a pressure applied from the both sides to the pair of plates; and a half-convex plate provided at least between at least the one plate of the paired plates and the laminated wafer, having convex plane in the main surface of the side contacting the plate with the flat main surface of the side contacting the laminated wafer.

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