| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor inspection system which can detect all abnormalities occurring at various parts across the inspection system, including an inspection board and inspection circuit elements at the periphery of interface. SOLUTION: An abnormality detection circuit 106 is placed on the same substrate 107 as a probe card substrate 101 of a probe card 102, which is installed during a normal inspection of a semiconductor chip to constitute a circuit abnormality detection system 108. The circuit abnormality detection system 108, as a substitute for the probe card 102 installed during the normal inspection, is installed by the same substrate 107 on a probe card mounting section of the pogo ring 104, thereby expanding an abnormality detection program and a circuit abnormality detection function, which have mainly been for a semiconductor tester, to a leading-edge part of the inspection system and detecting malfunctions in the inspection board 103 and the inspection circuit on the periphery of the pogo ring 104. COPYRIGHT: (C)2008,JPO&INPIT
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