| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg and a resin composition for metal-clad laminates having an excellent adhesion to conductor circuits while maintaining heat resistance. SOLUTION: The resin composition is used for forming a sheet-like prepreg by impregnating a base material with it and contains (A) an epoxy resin including 1,1-bis (2,7-diglycidyloxy-1-naphthyl) methane, (B) dicyandiamide and (C) an aromatic amino compound having an electron-withdrawing group in the molecule. The prepreg is obtained by impregnating a base material with the resin composition. The laminate is obtained by laminating not less than one sheet of the prepreg. COPYRIGHT: (C)2008,JPO&INPIT
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