发明名称 Backside contacts for MOS devices
摘要 A semiconductor structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface, a gate dielectric over the first surface of the semiconductor substrate, a gate electrode over the gate dielectric, a source/drain region having at least a portion in the semiconductor substrate, a dielectric layer having a first surface and a second surface opposite the first surface wherein the first surface of the dielectric layer adjoins the second surface of the semiconductor substrate, and a contact plug in the dielectric layer, wherein the contact plug extends from a bottom side of the source/drain region to the second surface of the dielectric layer.
申请公布号 US2007296002(A1) 申请公布日期 2007.12.27
申请号 US20060475707 申请日期 2006.06.27
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIANG MONG SONG;TAO HUN-JAN
分类号 H01L29/76 主分类号 H01L29/76
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