<p>A take up type vacuum vapor deposition device in which an occurrence of a thermally affected area on a film can be suppressed without impairing productivity. The take up type vacuum vapor deposition device (10) has a payout roller (13), a take up roller (15) for taking up a film (12) paid out from the payout roller (13), a cooling roller (14) disposed between the payout roller (13) and the take up roller (15) and cooling the film (12) by being in intimate contact with it, an evaporation source (16) disposed facing the cooling roller (14) and depositing an evaporation material on the film (12), and an electron beam irradiator (21) disposed between the payout roller (13) and the evaporation source (16) and irradiating the traveling film (12) with an electron beam. The electron beam irradiator (21) has a filament (31) for emitting electrons when it is heated by conduction and also has DC generation means for supplying a DC current to the filament (31).</p>