| 摘要 |
FIELD: radio-electronics, possible use for manufacturing electronic boards which are used for building radio-electronic equipment for aircraft and spacecraft engineering. ^ SUBSTANCE: in accordance to the invention, certain sections of copper foil are selectively etched together with applied galvanic copper cover, electro-conductive pattern of radio-technical circuit is created, then vacuum thermo-processing is performed at temperature of 80/160°C during 20/60 minutes, and silver cover is applied 8/10 micrometers thick by dipping the electronic board for 20/25 minutes into water solution which contains silver chloride or by mechanically rubbing the electronic board with a mixture which contains silver chloride and calcium carbonate. ^ EFFECT: production of electronic boards with copper electric circuit which contains no pores, with well soldering metallic cover which does not contain lead and cadmium. |
