| 发明名称 |
CHEMICAL MECHANICAL POLISHING MEMBRANE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a membrane in a support head for applying a substantially even load to the overall substrate of a chemical mechanical polishing unit which optimizes a polishing capability and ensures a desired flatness and finish. <P>SOLUTION: This membrane 162 is a chemical mechanical polishing membrane 162 comprising an annular membrane 167 with an external surface configured in a way that it contacts the substrate during polishing and an edge 164 projecting from this annular membrane 167. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2007335895(A) |
申请公布日期 |
2007.12.27 |
| 申请号 |
JP20070218692 |
申请日期 |
2007.08.24 |
| 申请人 |
APPLIED MATERIALS INC |
发明人 |
ZUNIGA STEVEN M;BIRANG MANOOCHER;CHEN HUNG;KO SEN-HOU |
| 分类号 |
H01L21/304;B24B37/30;B24B37/32;B24B49/16 |
主分类号 |
H01L21/304 |
| 代理机构 |
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