| 摘要 |
PROBLEM TO BE SOLVED: To provide a coating method of a liquid solder capable of obtaining a high density mounting of an insertion mounting electronic component and a surface mounting electronic component on the same surface of a print board and contributing to a cost reduction by using the same reflow process. SOLUTION: The method includes the steps of: disposing a backup pin jig 23 at a lower position of a hole 21a of a print board 21 corresponding to a terminal pin position of a component having a terminal pin structure, and making this jig elevated so that a pin 24 disposed on the jig is penetrated through the hole of the print board; lowering a discharge nozzle 27 disposed at an upper position of the hole of the print board and containing the liquid solder so that a pin of the backup pin jig is inserted into a tip end part of the discharge nozzle, and discharging the liquid solder of an amount corresponding to the insertion, to a copper foil surface 22 of the print board; and elevating the discharge nozzle so that the pin of the backup pin jig is pulled out downward from the hole of the print board, and forming a layer of a liquid solder 28 on the copper foil surface of the print board. COPYRIGHT: (C)2008,JPO&INPIT |
