PROCESS FOR PRODUCING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a process for producing a printed wiring board exhibiting excellent adhesion between an overlying conductor layer and an insulation layer, and suitable for forming a minute circuit where the surface roughness of an overlying insulation layer is very small. SOLUTION: In the process for producing a printed wiring board, an overlying metal foil is removed from a metal foil clad laminate plate, and a conductor layer is formed on an overlying insulation layer by plating. A specific polyimide resin layer is arranged in contact with an overlying metal foil in the metal foil clad laminate plate. COPYRIGHT: (C)2008,JPO&INPIT