发明名称 Miniature circuitry and inductive components and methods for manufaturing same
摘要 Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.
申请公布号 US2007294888(A1) 申请公布日期 2007.12.27
申请号 US20070895355 申请日期 2007.08.24
申请人 WHITTAKER RONALD W;GUERRA JOE D;MARCOCI CIPRIAN 发明人 WHITTAKER RONALD W.;GUERRA JOE D.;MARCOCI CIPRIAN
分类号 H05K3/42 主分类号 H05K3/42
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