| 摘要 |
A FOUP can be used either side up so that wafers can stand by with either of their major surfaces facing up. The body of the FOUP has first and second graspable members disposed at the top and bottom thereof, respectively. Each of the graspable members is configured to allow a transfer system of semiconductor device fabrication equipment to grasp the same and thereby transfer the FOUP. Likewise, the body of the FOUP has first and second support members disposed at the top and bottom thereof, respectively. Each of the support members can be fitted to the same portion of a load port of semiconductor device fabrication equipment. In addition, the body of the FOUP has door locking openings adjacent both the top and bottom thereof. The door of the FOUP has door locking members, and a key assembly that selectively moves the door locking members into and out of the door locking openings, respectively.
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