ELECTRON COMPONENTS PACKAGE

摘要

An electronic component package is provided to radiate heat from an LED device and to drive stably the LED device by forming a ceramic substrate with an efficient radiating structure. A substrate includes a light emitting element mounting region on which a light emitting element(32) is mounted. A heat-emitting medium is buried into a lower part of the light emitting element mounting region in order to be separated in a vertical direction to the light emitting element mounting region. The heat-emitting medium is exposed to a bottom surface of the substrate. A heat transfer medium is formed between the light emitting element mounting region and the heat-emitting medium. The thermal conductivity of the heat transfer medium, of which a size is equal to or larger than that of the alight emitting element, is higher than the thermal conductivity of the substrate.