Elektronisches Gerät und Verfahren zur Herstellung das selbe

摘要

An integrally multiple-molded part for electronic devices is provided capable of absorbing and relieving the internal stresses of a multiple-molded part, preventing the occurrence of clearances between the bonding side face of each electrical connection terminal 2 and a resin 3; 13, obtaining stable frictional force at the contact region between the bonding surface of the electrical connection terminal 2 and an aluminum wire 30, obtaining the energy required for bonding, and achieving high bondability. The surface of the molded electrical connection terminal section formed as a primary-molded article becomes exposed after secondary molding, and a stress-absorbing structure 4 is formed in the primary molding resin section 3 of the primary-molded article that serves as a transmission path for stresses associated with the resin shrinkage occurring when the secondary molding resin 13 is cured.