| 摘要 |
The assembly (22) involved in the fabrication of electronic cards compris es a plate (14) exhibiting a plurality of apertures (16) in which are respec tively housed a plurality of electronic modules (2). These electronic module s are assembled to the plate 14 by fixing means, in particular by fixing bri dges leaving a slot (26) over the major part of the surround of the electron ic module. For example the fixing means are formed by projecting parts (18) at the periphery of the apertures (16), these projecting parts exhibiting a smaller thickness than the thickness of the plate (14) and serving as suppor ts for the electronic modules, in particular for a substrate (12) of these m odules. Fixing is performed for example by welding or adhesive bonding. The invention also relates to an intermediate product formed by such an assembly and a filling material that fills at least the major part of the remaining space in the apertures (16). The invention also relates to a method of fabri cating cards in which the assembly according to the invention is finally coa ted in a resin to form substantially plane cards. |
