发明名称 SHIELDING APPARATUS OF LSI, SHIELDING METHOD OF LSI, AND LSI PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a shielding apparatus of LSI, a shielding method of LSI, and an LSI package for reducing radiation noise by shielding the LSI chip and effectively using a mounting area near the LSI as a decoupling capacitor and a termination resistance. SOLUTION: The LSI is constituted with an LSI package 1 for mounting an LSI chip 7, a printed circuit board 9 for mounting the LSI package 1, a heat sink 6, and a metal contact 5 for electrically connecting the LSI package 1 and the heat sink 6. The LSI package 1 is provided with a pad 2, a ground pin 4, and a via hole 3 for connecting the pad 2 and the ground pin 4. The ground pin 4 is connected with a ground layer 8 of the printed circuit board 9. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007335496(A) 申请公布日期 2007.12.27
申请号 JP20060163270 申请日期 2006.06.13
申请人 NEC CORP 发明人 FUJIMOTO SHUNSUKE
分类号 H01L23/00 主分类号 H01L23/00
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