发明名称 |
SINGLE WAFER DRYER AND DRYING METHODS |
摘要 |
In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.
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申请公布号 |
US2007295371(A1) |
申请公布日期 |
2007.12.27 |
申请号 |
US20070846400 |
申请日期 |
2007.08.28 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
ACHKIRE YOUNES;LERNER ALEXANDER;GOVZMAN BORIS T.;FISHKIN BORIS;SUGARMAN MICHAEL;MAVLEIV RASHID;FANG HAOQUAN;LI SHIJIAN;SHIRAZI GUY;TANG JIANSHE |
分类号 |
B08B1/00;H01L21/304;H01L21/00 |
主分类号 |
B08B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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