| 摘要 |
A circuit board device is disclosed that is able to be made thin. The a circuit board device includes a substrate having a notch at one end thereof, plural electrical parts mounted on an upper surface of the substrate, a resin portion burying the electrical parts, a metal plate arranged at an end portion of the upper surface of the substrate to cover the notch, and a lead connected to the metal plate and extending from the end of the substrate to the outside. One end of the lead is fit into the notch and is welded to a back side of the metal plate for connection to the metal plate.
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