An integrated packaging assembly for an MMIC that uses the semiconductor wafers on which circuit elements are fabricated as the package. The packaging assembly includes a plurality of semiconductor layers that have been diced from the semiconductor wafers, where the semiconductor layers can be made of different semiconductor material. The semiconductor layers define cavities therebetween in which circuit components are fabricated. A sealing ring seals the semiconductor layers together so as to hermetically seal the circuit components within the cavities.
申请公布号
WO2007149819(A2)
申请公布日期
2007.12.27
申请号
WO2007US71491
申请日期
2007.06.18
申请人
NORTHROP GRUMMAN SPACE & MISSIONS SYSTEMS CORP.;YANG, JEFFREY, MING-JER;CHUNG, YUN-HO;CHANG-CHIEN, PATTY