| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate having a structure wherein an electrically connected unit is installed with high density. SOLUTION: The manufacturing method of wiring substrate having the electrically connected unit formed by etching a conductive layer comprises a first process for forming a mask pattern on the conductive layer, and a second process for forming the electrically connected part by etching the conductive layer employing the mask pattern as a mask. In this case, the mask pattern is formed in the first process so that the end side of the same is warped toward the side of the conductive layer upon etching in the second process. COPYRIGHT: (C)2008,JPO&INPIT |
