| 摘要 |
PROBLEM TO BE SOLVED: To realize an electronic component module which can spread a conductive adhesive all over a junction region without flowing to a mounting region on a substrate, and is thereby excellent in junction strength between the substrate and a metallic member. SOLUTION: A side surface electrode 6 is formed in a side wall 1a of a substrate 1 of a ceramic multilayer substrate or the like from an upper end to a lower end in a thickness direction of the side wall 1a. The metallic member 3 has a click 5 which is joined to the side surface electrode 6 via the conductive adhesive, and a U-shaped cut-out portion 5a is formed from a lower end to an upper side in the click 5. The deepest part 5b of the cut-out portion 5a is formed below by a fine distance T, concretely at the region lower by 150μm from a position corresponding to an upper end 1b of the substrate 1. COPYRIGHT: (C)2008,JPO&INPIT |
