| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder supply apparatus which can prevent wire return phenomenon of a lead-free solder wire, and can supply a constant and required quantity of lead-free solder onto a lead frame. SOLUTION: The solder supply apparatus is provided with guide rollers 10, 11 and 12 with such a heater as a heating means that heats a lead-free solder wire 1 while the lead-free solder wire 1 is being fed from a spool 2 through the guide rollers and a supply guide. Due to such the guide rollers 10, 11 and 12 and softening of the lead-free solder wire 1, an elastic force of a material itself can be reduced, and the wire return phenomenon can be also prevented, thereby supply a constant and required quantity of lead-free solder onto the lead frame. COPYRIGHT: (C)2008,JPO&INPIT |
