| 摘要 |
PROBLEM TO BE SOLVED: To provide an attachment and a vacuum bonding device which can cool efficiently components formed by the thermal bonding in a short time, when applying the thermal bonding under vacuum atmosphere in a stacked state of components. SOLUTION: The attachment bonds a cavity 5 and a base 1a by thermal bonding in a vacuum chamber 9 which can introduce cooling gas. The attachment includes: a heater 8 for heating at least one of the cavity 5 and the base 1a; a holder 6 for holding the above base 1a; an elastic body 14 for carrying out elastic deformation by pressing; and a pressing member 7 for pressing the cavity 5 and the base 1a, or the above holder 6 via the elastic body 14. The vacuum bonding device comprises the attachment. COPYRIGHT: (C)2008,JPO&INPIT
|
