NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF PATTERN FORMING AND ELECTRONIC PART

摘要

A thermostable negative photosensitive resin composition excelling in sensitivity and resolution; a method of pattern forming in which a pattern of fine configuration excelling in sensitivity, resolution and heat resistance can be obtained; and a highly reliable electronic part with a pattern of fine configuration and properties. There is provided a negative photosensitive resin composition comprising a crosslinking agent capable of crosslinking or polymerization by the action of an acid, which crosslinking agent contains a compound having at least one methylol group or alkoxyalkyl group in each molecule. Preferably, the crosslinking agent capable of crosslinking or polymerization by the action of an acid is any of compounds of the general formula: (I) wherein X is a single bond or 1 to 4-valent organic group; each of R¹ and R² independently is a hydrogen atom or monovalent organic group; n is an integer of 1 to 4; and each of p and q independently is an integer of 0 to 4.