| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate conveyance method exhibiting excellent work efficiency in which a dispense step and a bonding step can be carried out continuously without producing a skipped pitch where dispensing cannot be performed or a skipped pitch portion where a die cannot be bonded, and to provide a substrate conveyance device. SOLUTION: A plurality of conveyed sheet-like substrates 1 are spaced apart by a predetermined dimension between the adjoining upstream side and downstream side, and intermittent feeding of an island 2 is performed by a predetermined pitch. After ending conveyance of one substrate 1 corresponding to the number of pitches, the substrate is fed at a different pitch determined by adding the predetermined dimension to a predetermined pitch. The island 2 of each sheet-like substrate 1 is made to correspond sequentially with the bonding position B. The dispenser position A is shifted by the predetermined dimension, and the island 2 of each sheet-like substrate 1 is made to correspond sequentially with the dispense position A. COPYRIGHT: (C)2008,JPO&INPIT
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