发明名称 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
摘要 |
A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of the electrodes; a conductive foil provided at a given spacing from the surface on which the passivation film is formed; an external electrodes formed on the conductive foil; intermediate layer formed between the passivation film and the conductive foil to support the conductive foil; and wires electrically connecting the electrodes to the conductive foil; wherein a depression tapered in a direction from the conductive foil to the passivation film if formed under a part of the conductive foil that includes the connection with the external electrodes.
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申请公布号 |
US2007296088(A1) |
申请公布日期 |
2007.12.27 |
申请号 |
US20070889467 |
申请日期 |
2007.08.14 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
HASHIMOTO NOBUAKI |
分类号 |
H01L23/12;H01L23/485;H01L21/60;H01L23/31;H01L23/498 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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