| 摘要 |
Method of fabricating at least one card each comprising an electronic module (2), this method envisaging the feeding of a frame (14) or a plate (18) exhibiting at least one aperture (16) designed to receive this electronic module. It is characterized in that at least one part of the peripheral region of this at least one aperture is deformed or squashed by applying a localized pressure to this at least one part of the peripheral region on the frame or plate, in such a way as to locally reduce the thickness of the frame or plate in this at least one part of the peripheral region, in that the electronic module is fed in opposite the corresponding aperture in such a way that at least one zone of this electronic module is superimposed on said at least one part of the peripheral region, and in that a hardware link is established between this at least one part of the peripheral region and said at least one corresponding zone of the electronic module so as to assemble this electronic module to the frame or to the plate before feeding in a resin at least on one side of this electronic module in a subsequent step of the method. |
