发明名称 RESIN-SEALED MODULE, OPTICAL MODULE AND METHOD OF RESIN SEALING
摘要 A resin-sealed module that even when a resin sealing is carried out astride mounted members having different linear expansion coefficients, is free from damaging by temperature change; and a relevant optical module and method of resin sealing. There is provided resin-sealed module (400) having mounted member (411) and mounted member (412) as mounted members having different linear expansion coefficients, wherein part (421) is sealed by means of sealing resin (441) lest the sealing region reach the mounted member (412), and wherein exposed portion of bonding wire (432) is sealed by means of sealing resin (442) with low Young's modulus.
申请公布号 WO2007148398(A1) 申请公布日期 2007.12.27
申请号 WO2006JP312510 申请日期 2006.06.22
申请人 FUJITSU LIMITED;TERADA, KOJI;MATSUI, JUN;NOBUHARA, HIROYUKI 发明人 TERADA, KOJI;MATSUI, JUN;NOBUHARA, HIROYUKI
分类号 H01L23/29;H01L21/56;H01L23/31;H01L25/16;H01S5/022 主分类号 H01L23/29
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