| 摘要 |
A method in which as compared with the conventional plating method, CVD m ethod, coating liquid method, electrodeposition method, etc., a metal oxide microparticle layer being uniform and excelling in adherence, abrasion resis tance, strength, etc. can be formed with extreme easiness. There is provided a method of forming a metal oxide microparticle layer on a conductive subst ratum, characterized in that a conductive substratum is immersed in a disper sion liquid containing metal oxide microparticles and fibrous microparticles and direct current is applied to the conductive substratum and the dispersi on liquid. The fibrous microparticles have a length (L) ranging from 50 nm t o 10 .mu.m, a diameter (D) ranging from 10 nm to 2 .mu.m and an aspect ratio (L/D) ranging from 5 to 1000. The fibrous microparticle content of the disp ersion liquid ranges from 0.1 to 20 wt.% based on metal oxide microparticles in terms of solid contents. The dispersion liquid further contains colloid particles of 2 to 300 nm average particle diameter. |
