| 摘要 |
PROBLEM TO BE SOLVED: To form a device pattern of uniform thickness on a substrate while reducing the production process and production cost in a device patterning method employing a liquid ejection head. SOLUTION: While moving a liquid ejection head and a substrate relatively, liquid is ejected from a liquid ejection head onto the substrate, thus forming a device pattern PT12. The device pattern PT12 is formed by forming a basic pattern PT having preset fixed width and length, and then forming a projection pattern PT13 to be coupled with the basic pattern PT at least partially. COPYRIGHT: (C)2008,JPO&INPIT
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