发明名称 THERMOPLASTIC RESIN COMPOSITION AND COMPOSITE MOLDING
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition imparting composite moldings which are excellent in chemical resistance and surface appearance, in the close adhesion of surface layers made of the composition to substrate resins such as PS resin or waste thereof, and in fabricability (such as chipping resistance) and endurance (such as heat cycle resistance); and composite moldings with surface layers made of the composition. <P>SOLUTION: The thermoplastic resin composition comprises 100 parts by mass of a vinyl (co)polymer (I) which is obtained by (co)polymerizing one or more monomers selected from the group consisting of aromatic vinyl compounds, vinyl cyanide and other vinyl monomers copolymerizable therewith and 1 to 100 parts by mass of a vinyl copolymer (II) which is obtained by copolymerizing vinyl cyanide with other vinyl monomer copolymerizable with vinyl cyanide, wherein the content of vinyl cyanide soluble in acetone is 0.1 to 15% by mass. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007332356(A) 申请公布日期 2007.12.27
申请号 JP20070123582 申请日期 2007.05.08
申请人 UMG ABS LTD 发明人 NISHIMOTO KAZUO;FURUE KATSUYA;HIRATA KOJI;NAGAO YOSHITO
分类号 C08L25/02;B29C45/14;B29C45/16;B29C47/02;B29C47/04;B29K25/00;B32B27/30;C08L33/20;C08L51/04;C08L53/00 主分类号 C08L25/02
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