| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier tool that suppresses contamination in a semiconductor wafer caused by the occurrence of cut refuse from a formed frame when removing an excess section of a dicing tape by using an edge tool, and reduces a possibility that the cut refuse adheres to a mark cut by the edge tool. SOLUTION: The carrier tool has a hollow frame 1 for storing the semiconductor wafer thinned by backgrinding, and a dicing tape 10 that is bonded onto a backside 4 of the frame 1 and adheres and holds the semiconductor wafer. A metal cut refuse occurrence prevention layer 20 adhering to the dicing tape 10 is laminated on the backside 4 of the frame 1 and suppresses and prevents the occurrence of cut refuse following the removal of an excess section 11 in the dicing tape 10 by the cut refuse occurrence prevention layer 20. A cutter edge 31 comes into contact with a hard cut refuse occurrence prevention layer 20 instead of the frame 1, thus preventing the occurrence of a foreign matter and hence preventing the backside 4 of the frame 1 from being cut by the cutter edge 31. COPYRIGHT: (C)2008,JPO&INPIT |
