发明名称 Two Packages Type Thermosetting Resin Composition, Film Forming Method and Coated Article
摘要 The great decrease of the curing time (in particular, halving) of acid/epoxy curing system paint and the further improvement of other performances (in particular, film performance). A two packages type thermosetting resin composition comprising (a) an acid anhydride group-containing acryl resin having an acid anhydride group of 0.08 to 5.3 mmol/g (solid content) and a number average molecular weight of 500 to 8000 that is obtained by copolymerizing an acid anhydride group-containing ethylenically unsaturated monomer with an ethylenically unsaturated monomer having no acid anhydride group, (b) a carboxylic group-containing polyester resin having a carboxylic group of 0.8 to 6.3 mmol/g (solid content) and a number average molecular weight of 400 to 3500 and a ratio of weight average molecular weight to number average molecular weight of 1.8 or less that is obtained by reacting an acid anhydride group-containing ethylenically unsaturated monomer with polyester polyol having 3 or more of hydroxyl groups, and (c) an acryl resin with hydroxyl groups and epoxy groups having a hydroxyl group of 0.08 to 5.4 mmol/g (solid content), an epoxy group of 1.2 to 10.0 mmol/g (solid content) and a number average molecular weight of 200 to 10000 that is obtained by copolymerizing a hydroxyl group-containing ethylenically unsaturated monomer and an epoxy group-containing ethylenically unsaturated monomer with an ethylenically unsaturated monomer not having a hydroxyl group and an epoxy group.
申请公布号 US2007298178(A1) 申请公布日期 2007.12.27
申请号 US20050592385 申请日期 2005.03.11
申请人 TANABE HISAKI;TSUJIOKA HIDEAKI 发明人 TANABE HISAKI;TSUJIOKA HIDEAKI
分类号 B05D7/24;C08L63/00;B05D1/34;B05D1/36;B05D3/02;B05D5/06;B05D7/00;B05D7/14;C08F220/08;C08F220/32;C08G59/32;C08G59/40;C08G59/42;C08G63/46;C08L33/00;C08L67/00;C09D5/00;C09D7/12;C09D133/00;C09D163/00;C09D167/00 主分类号 B05D7/24
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