| 发明名称 |
SOLDERABILITY IMPROVEMENT METHOD FOR LEADED SEMICONDUCTOR PACKAGE |
| 摘要 |
A microelectronic device package (100) that includes a microelectronic device (106) encapsulated within a packaging material (102). The microelectronic device package also includes a lead (104) attached to a portion of the microelectronic device extending through the packaging material. The lead has a break portion and a non-break portion on a tip of the lead. |
| 申请公布号 |
WO2007150032(A2) |
申请公布日期 |
2007.12.27 |
| 申请号 |
WO2007US71905 |
申请日期 |
2007.06.22 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED;MATSUNAMI, AKIRA |
发明人 |
MATSUNAMI, AKIRA |
| 分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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