发明名称 |
APPARATUS AND METHOD FOR SEMICONDUCTOR BONDING |
摘要 |
An apparatus for bonding semiconductor structures includes equipment for positioning a first surface of a first semiconductor structure directly opposite and in contact with a first surface of a second semiconductor structure and equipment for forming a bond interface area between the first surfaces of the first and second semiconductor structures by pressing the first and second semiconductor structures together with a force column configured to apply uniform pressure to the entire bond interface area between the first surfaces. |
申请公布号 |
WO2007150012(A2) |
申请公布日期 |
2007.12.27 |
申请号 |
WO2007US71857 |
申请日期 |
2007.06.22 |
申请人 |
SUSS MICROTEC, INC. |
发明人 |
GEORGE, GREGORY;HANCOCK, ETIENNE;CAMPBELL, ROBERT |
分类号 |
H01L27/12 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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