Verfahren zur elektrischen Kontaktierung mittels gefüllter Flüssigkeiten und elektronische Bauteile mit derartiger Kontaktierung

摘要

Production of conductor strips (1) comprises forming a liquid film (3) with a liquid having electrically conducting particles on the upper surfaces (4, 18) of a circuit carrier (5) with a semiconductor chip (10) or an electronic component with a semiconductor chip, structuring the film under the action of a local energy supply and forming a conductor strip structure (6) made from electrically conducting particles on the upper surfaces, removing the remaining liquid film from the surfaces to leave the conductor strip structure, and tempering the conductor strip structure to bind the conducting particles forming conductor strips. An Independent claim is also included for a device for structuring a liquid film during the production of conductor strips.