| 摘要 |
PROBLEM TO BE SOLVED: To accurately form fine pattern wiring and reduce a time for a manufacturing process. SOLUTION: The method comprises a step of pasting extremely thin copper foil 22 with carrier foil to both surfaces of an insulating base 3 with the foil facing each other, a step of stripping the carrier foil 20, a step of forming a series of wiring holes 4 piercing the thickness direction, a step of forming a conductive film 5 or a non-electrolytic plating layer on only walls of the wiring holes 4, a step of pasting dry films 6a, 6b to the surfaces of the copper foil 22 to form dry film patterns, a step of electrolytic-plating the copper foil 22 and the conductive film 5 or the non-electrolytic plating layer with an electrolyzing electrode base to electrolytically copper-plating exposed faces of the foil 22 and the walls of the wiring holes 4, a step of stripping the dry films 6a, 6b from the copper foil 22, and a step of flash-etching the foil 22. COPYRIGHT: (C)2008,JPO&INPIT
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