| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a conductor pattern that is independent of the density of pattern and can establish the uniformity of film thickness. SOLUTION: This method includes an electrolytic plating step wherein a conductor pattern is formed on a base metal film formed on an insulation substrate, by using a plating liquid containing a plating accelerating additive agent for reducing deposit overvoltage of plating metal. COPYRIGHT: (C)2008,JPO&INPIT
|
