| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of removing heat generating on a control substrate by a simple structure. SOLUTION: The semiconductor device 10 comprises a cooler 18, a semiconductor element 34 formed on the cooler 18, a control substrate 14 for controlling the semiconductor element 34, and a shield plate 16 which is interposed between the semiconductor element 34 and the control board 14 for shielding electromagnetic waves generated by the semiconductor element 34. The shield plate 16 is composed of a heat conductive material, and its end is sandwiched and fixed by a support member 22 projected on the control substrate 14 and the cooler 18. The end of the shield plate 16 has a heat conductive path 35 connected to the cooler 18 through a heat conductive member 38. The heat generating from the control substrate 14 is transferred to the cooler 18 by utilizing the heat conductive path 35 and the heat conductive member 38. As the heat conductive member 38, for instance, a metallic fixing bolt 38 is used for fixing the end of the shield plate 16 to the cooler 18. COPYRIGHT: (C)2008,JPO&INPIT |
