发明名称 |
CHIP STACK WITH A HIGHER POWER CHIP ON THE OUTSIDE OF THE STACK |
摘要 |
In some embodiments, a system includes a circuit board, a first chip, and a second chip stacked on the first chip. The first chip is coupled between the circuit board and the second chip, and the first chip includes circuitry to repeats commands the first chip receives to the second chip. Other embodiments are described. |
申请公布号 |
WO2007149709(A2) |
申请公布日期 |
2007.12.27 |
申请号 |
WO2007US70719 |
申请日期 |
2007.06.08 |
申请人 |
INTEL CORPORATION;SAINI, MANISH;MEHTA, DEEPA |
发明人 |
SAINI, MANISH;MEHTA, DEEPA |
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