发明名称 COOLING OF HIGH POWER DENSITY DEVICES BY ELECTRICALLY CONDUCTING FLUIDS
摘要 A system (200) to extract heat from a high power density device (202) and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit (203a) using one or more electronmagnetic pumps (211) for carrying away the heat from the high power density device and rejecting the heat sink (209) located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits (203) having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink.
申请公布号 WO2005060370(A3) 申请公布日期 2007.12.27
申请号 WO2003US39853 申请日期 2003.12.15
申请人 NANOCOOLERS, INC. 发明人 GHOSHAI, UTTAM;MINER, ANDREW, CARL
分类号 H01L23/34;F04B17/00;F04B17/03;F25B21/02;F25B25/00;F28D15/00;F28D17/02;H01L23/473;H02K11/00;H02K44/04 主分类号 H01L23/34
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