METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A method for manufacturing a semiconductor device is provided to reduce a manufacturing cost by packaging a cell region and a peripheral region on different wafers. A first manufacturing process is performed to manufacture a cell region on a first wafer as a chip(S101). A second manufacturing process is performed to manufacture a low-voltage region on a second wafer as a chip(S103). A third manufacturing process is performed to manufacture a high-voltage region on a third wafer as a chip(S105). A sawing process is performed to cut each of the chips formed on the first to third wafers(S107). A first to third packaging regions as chip packaging spaces are formed on a fourth wafer(S109). The chips formed on the first to third wafers are packaged on the first to third packaging regions(S111).