发明名称 ELECTRON BEAM DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electron beam device to carry out with high throughput evaluation of a test piece such as a semiconductor wafer having a minute pattern of 0.1μm or less. SOLUTION: The electron beam device irradiates primary electron beams generated by an electron gun on a test piece and forms the secondary electrons emitted from the test piece on a detector by a map projection optical system. The electron gun 61 has a cathode 1 and an extraction electrode 3 and the electron emitting face 1a of the cathode is concave. The extraction electrode 3 has a convex surface 3a consisting of partial outer faces of a second sphere facing the electron emitting face 1a of the cathode and a hole 73 to penetrate the convex surface for passing the electrons. An astigmatism generating lens 44 of multipoles is provided between the extraction electrode 3 and the test piece. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007335125(A) 申请公布日期 2007.12.27
申请号 JP20060162948 申请日期 2006.06.13
申请人 EBARA CORP 发明人 HATAKEYAMA MASAKI;MURAKAMI TAKESHI;NOMICHI SHINJI;NAKASUJI MAMORU
分类号 H01J37/06;H01J37/141;H01J37/244;H01J37/29 主分类号 H01J37/06
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