LOW VISCOSITY CURABLE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a low viscosity capillary flow underfill composition having improved filler dispersibility and curing rate. SOLUTION: One embodiment of the composition comprises one or more epoxy resins (such as an alicyclic epoxy resin), one or more catalysts (such as a hyperacid catalyst) and one or more inert components and may contain a diluent (such as a non-electroconductive filler), Another embodiment further contains a low viscosity non-epoxy reactive diluent (such as a vinyl ether) and polyols (such as polyester polyols). A further embodiment is a method of assembling electronic parts by utilizing the low viscosity underfill composition. A still further embodiment is electronic devices or parts comprising the underfill composition. COPYRIGHT: (C)2008,JPO&INPIT