| 摘要 |
Methods and systems for controlled formation of a resist in a via. In one embodiment, a method for plating at least a portion of the inside of a via formed in an object may include filling the via with a resist capable of selective three-dimensional polymerization. The resist may be selectively polymerized, and developed. When the resist is developed, only a portion of the resist is removed according to whether the portion is polymerized, thereby leaving a remaining portion in the via and forming a desired structure in the via.
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