| 摘要 |
An LED chip package structure with a high-efficiency light-emitting effect, includes a substrate unit, a light-emitting unit, and a package colloid unit. The substrate unit has a substrate body, and a positive electrode trace and a negative electrode trace respectively formed on the substrate body. The light-emitting unit has a plurality of LED chips disposed on the substrate body. Each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit. The package colloid unit has a plurality of package colloids covered on LED chips, respectively. Each package colloid has a colloid cambered surface formed on a top surface thereof and a colloid light-exiting surface formed on a front surface thereof. |
