| 摘要 |
A semiconductor device package and a packaging method thereof are provided to prevent defects of a solder sealing ring and a solder joint part by melting the solder ball between a substrate assembly and an external circuit substrate to have a different melting point. A semiconductor device package comprises a semiconductor device(10), a substrate assembly(20), a solder sealing ring(11) and a plurality of solder balls(25). The substrate assembly is faced to the semiconductor device. The solder sealing ring seals closely the semiconductor substrate and the substrate assembly. The solder balls are formed outside of the solder sealing ring of the substrate assembly. A melting point of the solder sealing ring is higher than the melting point of the solder ball. |
