| 摘要 |
Provided is a semiconductor device wherein a wire bonded to an island is surely prevented from being disconnected due to thermal shock, temperature cycle, and the like, in mounting, and further, a large increase in a manufacturing process time can be eliminated. In the semiconductor device, a semiconductor chip is die-bonded on the surface of the island, one end of a first wire is bonded to an electrode formed on the surface of the semiconductor chip to form a first bonding section, and the other end of the first wire is bonded to the island to form a second bonding section. The semiconductor device is resin-sealed. The semiconductor device is characterized in that a double bonding section formed by having the second wire bonded thereon is arranged on the second bonding section of the first wire bonded on the island. |
