| 摘要 |
An LED module and a backlight unit using the same are provided to emit the heat generated from LED chips efficiently, by mounting the LED chips directly on a metal core PCB. A circuit pattern(102) is formed on an upper surface of a metal core PCB(101). A plurality of LED chips(103) are mounted on the circuit pattern while the LED chips are linearly arranged. A vertical package part(104) packages the LED chips, respectively. The vertical package part is extended to a portion of the upper surface of the PCB outside respective LED chips. The vertical package part includes a fluorescent material. |
