| 摘要 |
A thermal improvement for hot spots on dies in an integrated circuit package is provided to eliminate heat from the hot spots selectively by applying thermal interconnection members to offer more paths for transmitting the heat. A die(102) is attached on a substrate. The die comprises a contact pad which emits more heats than a second position of the surface of the die. And the contact pad is located at a hot spot of a surface of an IC(Integrated Circuit) die. At least one die bond is attached between the die and the substrate. A thermal interconnection member(208) is attached to the contact pad. An IC package(200) manufacturing method comprises the die and at least one die bond, and a process to seal a part of the thermal interconnection member by a mold compound(112) is further comprised. |
