发明名称 MICROFLUIDIC COOLING OF INTEGRATED CIRCUITS
摘要 A microchannel cooling system used to cool integrated circuits may include a number of microchannels which may be subject to bubble blockage. When bubble formation or nucleation occurs due to heating, the bubbles may become trapped within the microchannels. A valve within the microchannel may automatically operate, at least partially, to close off the microchannel, allowing the bubble to be freed and to be flushed from the channel in some embodiments.
申请公布号 EP1869703(A1) 申请公布日期 2007.12.26
申请号 EP20060750238 申请日期 2006.04.11
申请人 INTEL CORPORATION 发明人 DISHONGH, TERRY;CASSEZZA, JASON;RHODES, KEVIN
分类号 H01L23/473 主分类号 H01L23/473
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